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Current IssueInner Layer Precision & Yields
In this issue, we examine the critical nature of building precisions into your inner layers and assessing their pass/fail status as early as possible. Whether it’s using automation to cut down on handling issues, identifying defects earlier, or replacing an old line...
Engineering Economics
The real cost to manufacture a PCB encompasses everything that goes into making the product: the materials and other value-added supplies, machine and personnel costs, and most importantly, your quality. A hard look at real costs seems wholly appropriate.
Alternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
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Join iNEMI's PEG Workshop/TWG Kick-Off at IPC APEX EXPO 2018
February 21, 2018 | iNEMIEstimated reading time: Less than a minute
As the IPC APEX EXPO events approach, iNEMI’s preparations for the Product Emulator Group (PEG) Workshop and Technology Working Group (TWG) Kick-Off on February 25 and 26 are finalizing. Attendees will hear updates from all the PEGs with respect to the latest industry analyses from Prismark, and then the TWG teams will formalize and share their plans to revise their reports.
iNEMI is also evangelizing for the roadmap effort during APEX EXPO week, spreading the word of this historical electronics roadmap and the value it brings to iNEMI members, roadmap participants and, of course, the electronics industry.
For more information and how to register for the PEG Workshop/TWG Kick-Off at IPC APEX EXPO, click here.
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