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Current IssueEngineering Economics
The real cost to manufacture a PCB encompasses everything that goes into making the product: the materials and other value-added supplies, machine and personnel costs, and most importantly, your quality. A hard look at real costs seems wholly appropriate.
Alternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
Technology Roadmaps
In this issue of PCB007 Magazine, we discuss technology roadmaps and what they mean for our businesses, providing context to the all-important question: What is my company’s technology roadmap?
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Join iNEMI's PEG Workshop/TWG Kick-Off at IPC APEX EXPO 2018
February 21, 2018 | iNEMIEstimated reading time: Less than a minute
As the IPC APEX EXPO events approach, iNEMI’s preparations for the Product Emulator Group (PEG) Workshop and Technology Working Group (TWG) Kick-Off on February 25 and 26 are finalizing. Attendees will hear updates from all the PEGs with respect to the latest industry analyses from Prismark, and then the TWG teams will formalize and share their plans to revise their reports.
iNEMI is also evangelizing for the roadmap effort during APEX EXPO week, spreading the word of this historical electronics roadmap and the value it brings to iNEMI members, roadmap participants and, of course, the electronics industry.
For more information and how to register for the PEG Workshop/TWG Kick-Off at IPC APEX EXPO, click here.
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IPC Japan Puts More Focus on Collaboration, Standards Development, Advanced Packaging
11/26/2024 | Yusaku Kono, IPC Japan RepresentativeIn the past year, IPC has strengthened its relationships with key Japanese companies and government bodies. This was accomplished, in part, by a visit to Japan this past summer, where members of the IPC Asia team, punctuated by standards committee work last winter, forged stronger ties with government officials and companies involved in electronics manufacturing.
Subdued Electronics Industry Sentiment Continues in November
11/25/2024 | IPCIPC releases November 2024 Global Sentiment of the Electronics Manufacturing Supply Chain report
NEOTech Significantly Improves Wire Bond Pull Test Process
11/25/2024 | NEOTechNEOTech, a leading provider of electronic manufacturing services (EMS), design engineering, and supply chain solutions in the high-tech industrial, medical device, and aerospace/defense markets, proudly announces a major advancement in its wire bond pull testing process, reducing manufacturing cycle time by more than 60% while maintaining industry-leading production yields of over 99.99%.
PCB Design Software Market Expected to Hit $9.2B by 2031
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